Description

With FlipChip platform technology, LUXEON UV FC Line contains both 1mm² and 2mm² die sizes and is the smallest and highest power density (W/cm²) ultraviolet with FlipChip Technology in a Chip Scale Package (CSP) LED that can be reflowed onto a substrate with standard surface mount (SMT) equipment and process. LUXEON UV FC Line LEDs enable tighter beam control and high packing density of LEDs on a chip on board solution and completely eliminate wire bonds in the system. LUXEON UV FC Line is the ideal choice for cost sensitive applications to achieve high irradiance at high current density, maximizing W/$ by taking advantage of lowest thermal resistance of a CSP device.

Features & Benefits

• Ultraviolet wavelength range of 380nm to 420nm for a range of options
• Micro sized CSP: 1.0mm² package for design flexibility and packing density
• No wire bonds allows for direct attach and reflow
• 5-sided emitter with batwing radiation pattern
• Low thermal resistance for leading system level W/$
• Maximum drive current of 1A/mm² delivers superior flux for reduced LED count

Applications

• Specialty Lighting
• Analytical Instrumentation
• Curing
• Medical
• Security

 

LUXEON UV FC1 product performance at 500mA and 1000mA, T_j=25°C.